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Industrial grade chip

Industrial grade chip, Total:56 items.

In the international standard classification, Industrial grade chip involves: Electronic components in general, Optoelectronics. Laser equipment, Integrated circuits. Microelectronics, Components for electrical equipment, Photography, Materials for aerospace construction, Non-destructive testing, Electric filters, Electric road vehicles, Pipeline components and pipelines, Ceramics, Microprocessor systems.


SCC, Industrial grade chip

  • MIL MIL-PRF-32159-2004 RESISTORS, CHIP, FIXED, ZERO OHM, INDUSTRIAL, HIGH RELIABILITY, SPACE LEVEL, GENERAL SPECIFICATION FOR
  • MIL MIL-PRF-32159/9-2004 RESISTORS, CHIP, FIXED, ZERO OHM, INDUSTRIAL, HIGH RELIABILITY, SPACE LEVEL, STYLE RCZ2512
  • MIL MIL-PRF-32159/8-2004 RESISTORS, CHIP, FIXED, FILM, ZERO OHM, INDUSTRIAL, HIGH RELIABILITY, SPACE LEVEL, STYLE RCZ2010
  • MIL MIL-PRF-32159/3-2004 RESISTORS, CHIP, FIXED, FILM, ZERO OHM, INDUSTRIAL, HIGH RELIABILITY, SPACE LEVEL, STYLE RCZ1005
  • MIL MIL-PRF-32159/2-2004 RESISTORS, CHIP, FIXED, FILM, ZERO OHM, INDUSTRIAL, HIGH RELIABILITY, SPACE LEVEL, STYLE RCZ0505
  • MIL MIL-PRF-32159/12-2004 RESISTORS, CHIP, FIXED, FILM, ZERO OHM, INDUSTRIAL, HIGH RELIABILITY, SPACE LEVEL, STYLE RCZ0603
  • MIL MIL-PRF-32159/1-2004 RESISTORS, CHIP, FIXED, FILM, ZERO OHM, INDUSTRIAL, HIGH RELIABILITY, SPACE LEVEL, STYLE RCZ0502
  • MIL MIL-PRF-32159/6-2004 RESISTORS, CHIP, FIXED, FILM, ZERO OHM, INDUSTRIAL, HIGH RELIABILITY, SPACE LEVEL, STYLE RCZ0705
  • MIL MIL-PRF-32159/11-2004 RESISTORS, CHIP, FIXED, FILM, ZERO OHM, INDUSTRIAL, HIGH RELIABILITY, SPACE LEVEL, STYLE RCZ0402
  • MIL MIL-PRF-32159/13-2004 RESISTORS, CHIP, FIXED, FILM, ZERO OHM, INDUSTRIAL, HIGH RELIABILITY, SPACE LEVEL, STYLE RCZ0302
  • MIL MIL-PRF-32159/7-2004 RESISTORS, CHIP, FIXED, FILM, ZERO OHM, INDUSTRIAL, HIGH RELIABILITY, SPACE LEVEL, STYLE RCZ1206
  • MIL MIL-PRF-32159/10-2004 RESISTORS, CHIP, FIXED, FILM, ZERO OHM, INDUSTRIAL, HIGH RELIABILITY, SPACE LEVEL, STYLE RCZ1010
  • MIL MIL-PRF-32159/5-2004 RESISTORS, CHIP, FIXED, FILM, ZERO OHM, INDUSTRIAL, HIGH RELIABILITY, SPACE LEVEL, STYLE RCZ2208
  • MIL MIL-PRF-32159/4-2004 RESISTORS, CHIP, FIXED, FILM, ZERO OHM, INDUSTRIAL, HIGH RELIABILITY, SPACE LEVEL, STYLE RCZ1505

Group Standards of the People's Republic of China, Industrial grade chip

  • T/CIE 071-2020 Evaluation of Industrial High Reliability Integrated Circuits Part 6: Bluetooth Chips
  • T/ZS 0646-2024 IC level flip chip die bonder
  • T/QGCML 4423-2024 Automotive-grade storage control chip
  • T/CASME 572-2023 (AEC-Q100 Qualified)Vehicle regulation level power management chip
  • T/SXS 067-2024 Chip Tape-out Service Process Specification
  • T/SXS 068-2024 Chip Tape-out Service Process Specification
  • T/SZBX 018-2021 Products of Wafer Level Chip Scale Package
  • T/SXS 004-2024 5G filter chip-level package technical specification
  • T/JSSIA 0004-2017 Outline Dimensions of Wafer Level Chip Scale Package
  • T/JSSIA 0003-2017 Series Programs for Wafer Level Chip Scale Package
  • T/CSAE 222-2021 Battery electric passenger vehicle automotive grade integrated circuit general requirements
  • T/CAS ES530799001-2022 Rules for quality grading and evaluating of industrial products—Spiral wound gaskets
  • T/CESA 1121-2020 AI chips-Test metrics and test method of deep learning chips for terminal side
  • T/CESA 1119-2020 AI chips-Test index and test method of deep learning chips for cloud side
  • T/ISC 0061-2024 Standard for Common Central Processing Unit Integrated Circuit Hardware Vulnerability Classification and Rating

IPC - Association Connecting Electronics Industries, Industrial grade chip

Defense Logistics Agency, Industrial grade chip

  • DLA MIL-PRF-32159 SUPP 1-2004 RESISTORS, CHIP, FIXED, FILM, ZERO OHM, INDUSTRIAL, HIGH RELIABILITY, SPACE LEVEL, GENERAL SPECIFICATION FOR
  • DLA QPL-32159-QPD-2010 Resistors, Chip, Fixed, Film, Zero OHM, Industrial, High Reliability, Space Level, General Specification for
  • DLA QPL-32159-2011 Resistors, Chip, Fixed, Film, Zero OHM, Industrial, High Reliability, Space Level, General Specification for
  • DLA QPL-32159-2012 Resistors, Chip, Fixed, Film, Zero OHM, Industrial, High Reliability, Space Level, General Specification for

IEC - International Electrotechnical Commission, Industrial grade chip

  • PAS 62084-1998 Implementation of Flip Chip and Chip Scale Technology (Edition 1.0; No Replacement)

TIA - Telecommunications Industry Association, Industrial grade chip

  • J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps (IPC/EIA J-STD-028)

SAE - SAE International, Industrial grade chip

(U.S.) Telecommunications Industries Association?, Industrial grade chip

  • TIA J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps IPC/EIA J-STD-028

Institute of Interconnecting and Packaging Electronic Circuits (IPC), Industrial grade chip

  • IPC J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps IPC/EIA J-STD-028

HU-MSZT, Industrial grade chip

  • MSZ 14593/4-1979 Dissolving cores for road vehicles, tablet dissolving cores (dissolving tablets)

Society of Automotive Engineers (SAE), Industrial grade chip

Professional Standard - Electron, Industrial grade chip

  • SJ/T 11734-2019 Blank detail specification for chip scale package(CSP)light-emitting diodes

Electronic Industrial Alliance (U.S.), Industrial grade chip

  • EIA EIA-763-2002 Bare Die and Chip Scale Packages Taped in 8 mm & 12 mm Carrier Tape for Automatic Handling

Korean Agency for Technology and Standards (KATS), Industrial grade chip

  • KS B ISO 11699-1:2001 Non-destructive testing-Industrial radiographic films-Part 1:Classification of film systems for industrial radiography
  • KS B ISO 11699-1:2016 Non-destructive testing-Industrial radiographic films-Part 1:Classification of film systems for industrial radiography

ECIA - Electronic Components Industry Association, Industrial grade chip

  • IS-763-1998 Bare Die and Chip Scale Packages Taped in 8 mm & 12 mm Carrier Tape for Automatic Handling
  • EIA-800-1999 Integrated Passive Device (IPD) Chipscale Package Design Guidelines

中華人民共和國國家質(zhì)量監(jiān)督檢驗檢疫總局、中國國家標準化管理委員會, Industrial grade chip

  • GB/T 33922-2017 Wafer level test methods for MEMS piezoresistive pressure-sensitive die performances

British Standards Institution (BSI), Industrial grade chip

  • BS EN 1006:2009 Advanced technical ceramics - Monolithic ceramics - Guidance on the selection of test pieces for the evaluation of properties




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